演讲嘉宾-Li Shi

Li Shi
德克萨斯州大学奥斯汀分校

Li Shi是德克萨斯州大学奥斯汀分校的材料工程系教授。在加入该校之前,他从事了一年的IBM研究工作。他分别于1991年获得清华大学的学士学位,1997年获得亚利桑那州立大学的硕士学位,2001年获得加州大学伯克利分校的博士学位。他目前担任纳米级和微米级热物理工程的主编。他的研究成果和专业服务获得了许多认可:国家科学基金会职业奖,海军研究办颁发的青年研究者奖,传热杂志的杰出评论家奖,德克萨斯医学、工程和科学研究院颁发的奥唐奈工程奖。

他当选并加入了美国物理学会(APS)和美国机械工程师协会(ASME)。


演讲题目:Thermal Transport Properties and Thermal Management Prospect of Two-dimensional Layered Materials
主题会场B20 石墨烯在导热/导电塑料领域的应用
开始时间
结束时间
内容摘要

Two-dimensional (2D) layered materials have received rapidly increasing interest for a variety of applications including thermal management. Among them, graphene and hexagonal boron nitride (h-BN) are being widely investigated because of high basal plane thermal conductivity. The theoretic basal plane thermal conductivity values for clean free-standing single layer graphene can be record high because of suppression of interlayer phonon scattering. For thermal management applications, however, the 2D heat spreaders have to be in contact with a heat source and a heat sink, or embedded in a medium, and the interaction with a dissimilar material can suppress in-plane phonon transport and thermal conductivity in a 2D sheet. The suppression is even more pronounced than the inter-layer interaction between adjacent similar 2D layers in a three-dimensional stack such as graphite or bulk h-BN. Understanding the effects of interface interaction on in-plane and cross-plane phonon transport in 2D materials is thus necessary for properly evaluating the thermal management potentials of 2D materials. Besides examining this basic research question, this talk will also provide an update on on-going developments of other architectures of 2D building blocks, including nanotubes, continuous foam structures, and hybrid and composite structures, as high-performance thermal management materials. 

关于主办方

联系我们
400-110-3655   

E-mail: meeting@c-gia.cn   meeting01@c-gia.cn

参展电话:13646399362(苏老师)

主讲申请:19991951101(王老师)

官方微信订阅号
Copyright © 中国国际石墨烯创新大会 版权所有     运营机构:北京现代华清材料科技发展有限责任公司
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京公网安备 11010802023402号
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凯发_Li Shi

凯发

演讲嘉宾-Li Shi

Li Shi
德克萨斯州大学奥斯汀分校

Li Shi是德克萨斯州大学奥斯汀分校的材料工程系教授。在加入该校之前,他从事了一年的IBM研究工作。他分别于1991年获得清华大学的学士学位,1997年获得亚利桑那州立大学的硕士学位,2001年获得加州大学伯克利分校的博士学位。他目前担任纳米级和微米级热物理工程的主编。他的研究成果和专业服务获得了许多认可:国家科学基金会职业奖,海军研究办颁发的青年研究者奖,传热杂志的杰出评论家奖,德克萨斯医学、工程和科学研究院颁发的奥唐奈工程奖。

他当选并加入了美国物理学会(APS)和美国机械工程师协会(ASME)。


演讲题目:Thermal Transport Properties and Thermal Management Prospect of Two-dimensional Layered Materials
主题会场B20 石墨烯在导热/导电塑料领域的应用
开始时间
结束时间
内容摘要

Two-dimensional (2D) layered materials have received rapidly increasing interest for a variety of applications including thermal management. Among them, graphene and hexagonal boron nitride (h-BN) are being widely investigated because of high basal plane thermal conductivity. The theoretic basal plane thermal conductivity values for clean free-standing single layer graphene can be record high because of suppression of interlayer phonon scattering. For thermal management applications, however, the 2D heat spreaders have to be in contact with a heat source and a heat sink, or embedded in a medium, and the interaction with a dissimilar material can suppress in-plane phonon transport and thermal conductivity in a 2D sheet. The suppression is even more pronounced than the inter-layer interaction between adjacent similar 2D layers in a three-dimensional stack such as graphite or bulk h-BN. Understanding the effects of interface interaction on in-plane and cross-plane phonon transport in 2D materials is thus necessary for properly evaluating the thermal management potentials of 2D materials. Besides examining this basic research question, this talk will also provide an update on on-going developments of other architectures of 2D building blocks, including nanotubes, continuous foam structures, and hybrid and composite structures, as high-performance thermal management materials. 

关于主办方

联系我们
400-110-3655   

E-mail: meeting@c-gia.cn   meeting01@c-gia.cn

参展电话:13646399362(苏老师)

主讲申请:19991951101(王老师)

官方微信订阅号
Copyright © 中国国际石墨烯创新大会 版权所有     运营机构:北京现代华清材料科技发展有限责任公司
grapchina.org 京ICP备10026874号-12   grapchina.cn 京ICP备10026874号-23
京公网安备 11010802023402号
分享到: