Mingxiang Chen is a professor in School of Mechanical Science and Engineering at Huazhong University of Science and Technology. He received his B. S. and M. S. in Materials Science from Wuhan University of Technology, and his Ph. D. in Physical Electronics from Huazhong University of Science and Technology. During 2008-2009, he was awarded a postdoctoral fellowship with Professor C. P. Wong at Packaging Research Center (PRC) in Georgia Institute of Technology.
Currently, his research interests focus on electronic packaging technologies and materials, including high-power LED packaging, nanopackaging and low temperature bonding. He has published over 40 technical papers and holds over 10 patents.
演讲题目：Thermal Management of High-power LED Packaging：Materials and Processes
内容摘要
Thermal management is one of the key technologies for high-power light emitting diodes (LEDs) packaging, which can greatly affect the luminous efficiency, brightness and reliability of LED devices. Actually, there are many factors which involving in the thermal management of LED package, including LED chip structure, packaging materials (thermal interface materials and heat spreader), packaging structure and packaging processing. In this talk, some packaging materials for thermal management of HP LED devices were introduced, and some factors which affected the thermal resistance of high-power LED devices are analyzed in detail, it indicating that thermal management of LED package is a systematic concept, each thermal resistance in thermal path should be considered integrated and synthetically, decreasing only one of them cannot solve the problem of thermal management of LEDs.
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